Publications

Affichage de 5561 à 5570 sur 6419


  • Article dans une revue

An open source and creative motion control system

Nicolas Lissarrague, G. Albrecht, L. Saini

Animation Practice, Process & Production, 2013, 2 (1 et 2), pp.151-187. ⟨hal-03267190⟩

  • Communication dans un congrès

Protocoles expérimentaux pour la caractérisation de la décohésion dynamique des Composites à Matrice Organique

Vincent Joudon, Gerald Portemont, Franck Lauro, Bruno Bennani

MECADYMAT 2013, Apr 2013, Brest, France. ⟨hal-03513282⟩

  • Article dans une revue

Les consultations électorales du 5 mai 2011: l'unité du Royaume-Uni à l'épreuve du conservatisme du centre et des nationalismes de la périphérie

Edwige Camp-Pietrain, Moya Jones

Individu et nation (Collection), 2013, Les consultations électorales du 5 mai 2011 au Royaume-Uni, 5. ⟨hal-04085431⟩

  • Article dans une revue

Images of the Protestants in Northern Ireland: A Cinematic Deficit or an Exclusive Image of Psychopaths?

Cecile Bazin

InMedia : the French Journal of Media and Media Representations in the English-Speaking World, 2013, 14. ⟨hal-04548973⟩

  • Ouvrages

Trends in practical applications of agents and multiagent systems : 11th International Conference on Practical Applications of Agents and Multi-Agent Systems

Javier Bajo Pérez

Javier Bajo Pérez, Juan M. Corchado Rodríguez, Johannes Fähndrich, Philippe Mathieu, Andrew Campbell, Mari Carmen Suarez-Figueroa, Alfonso Ortega, Emmanuel Adam, Elena Navarro, Ramon Hermoso, María N. Moreno. Springer International Publishing, 221, 2013, Advances in Intelligent Systems and Computing, 978-3-319-00562-1. ⟨10.1007/978-3-319-00563-8⟩. ⟨hal-03470997⟩

  • Communication dans un congrès

Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module

Camille Jeanne Margot Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a…

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wrockaw, Poland. ⟨10.1109/EuroSimE.2013.6529900⟩. ⟨hal-03513207⟩

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